Apparatus and system on a chip for printing based on processing of baseband signals

ABSTRACT

A system includes a circuit board mounted within a printer. A first chip is mounted on the circuit board. A transceiver includes a receiver that: is implemented in the first chip; wirelessly receives a radio frequency signal; and generates a first baseband signal based on the radio frequency signal. A transmitter of the transceiver is implemented in the first chip and wirelessly transmits, based on a second baseband signal, a second radio frequency signal. A second chip is separate from the first chip and is mounted on the circuit board. The second chip includes first and second processing modules and a processor. The first processing module processed the first and second baseband signals and generates a data signal based on the first baseband signal. The processor generates the second baseband signal based on the first baseband signal. The second processing module implements a printing process based the data signal.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. patentapplication Ser. No. 13/453,607 (now U.S. Pat. No. 8,477,357), filedApr. 23, 2012 which is a continuation of U.S. patent application Ser.No. 11/751,687 (now U.S. Pat. No. 8,164,773) filed on May 22, 2007. Thisapplication claims the benefit of U.S. Provisional Application No.60/808,634, filed on May 26, 2006. The disclosures of the aboveapplications are incorporated herein by reference in their entirety.

FIELD

The present disclosure relates to wireless printing interfaces, and moreparticularly to wireless printer architectures.

BACKGROUND

The background description provided herein is for the purpose ofgenerally presenting the context of the disclosure. Work of thepresently named inventors, to the extent it is described in thisbackground section, as well as aspects of the description that may nototherwise qualify as prior art at the time of filing, are neitherexpressly nor impliedly admitted as prior art against the presentdisclosure.

Wireless printers eliminate the need for printer cables and/or existingwired network connections near a desired printer location. Referring toFIG. 1, a wireless printer architecture 10 for wireless printing isshown. The architecture 10 includes a wireless subsystem 12 thatcommunicates with an imaging subsystem 14 via an interface 16. Thewireless subsystem 12 is used in addition to the imaging subsystem 14 toprovide wireless communication capability. The imaging subsystem 14 maybe similar to a traditional imaging circuit that is used in a printerwith a wired communication connection. The interface 16 is coupledbetween respective input/output interfaces 18, and may include a serialperipheral interface (SPI), a serial peripheral input/output (SPIO), aUSB and/or other suitable interface.

The wireless subsystem 12 communicates with and is connected to a radiofrequency (RF) transceiver 22 via a communication interface 24. Thetransceiver 22 transmits and receives RF print command and data signalsvia an antenna 26 from a print request device, such as a remotecomputer. The transceiver 22 includes a receiver 27 and a transmitter28. During receiver operation, an input of a low noise amplifier (LNA)29 receives signals from the antenna 26, amplifies the signals andoutputs them to the receiver 27. During transmitter operation, an outputof the transmitter 28 is received by a power amplifier (PA) 30, whichoutputs amplified signals to the antenna 26. While not shown, thetransceiver 22 may also include a frequency synthesizer, a phase lockedloop (PLL), and/or a voltage controlled oscillator (VCO).

The wireless subsystem 12 includes a baseband circuit 32 that may bearranged on a first printed circuit board (PCB) 34. The baseband circuit32 includes baseband hardware 36 and a wireless microprocessor (μP) 38.The baseband circuit 32 communicates with a random access memory (RAM)40 and a read only memory (ROM) 42. The ROM 42 stores baseband and otherwireless interface software 44 that is used in processing receivedbaseband signals.

The imaging subsystem 14 includes an imaging circuit 50 that is arrangedon a second PCB 52. The imaging circuit 50 includes imaging hardware 54,an imaging microprocessor 56, a RAM 58 and a ROM 60. The imaging circuit50 communicates with one or more input/output (I/O) interfaces 62. TheROM 60 stores imaging software 61 that is used to generate print readyoutput signals. The I/O interfaces 62 may include a network connection64, a USB connection 66, as shown, or other network and peripheralconnections. The imaging circuit 50 is connected to a print mechanism70, which includes electrical and mechanical elements of a printer thatimplement a physical print process. Printing output of the printmechanism is based on the print ready output signals. Widespread use ofprinters with wireless communication capability has not occurred atleast partially due to the cost associated therewith.

SUMMARY

A system is provided and includes a first circuit board, a first systemon a chip, a wireless transceiver, and a second system on a chip. Thefirst circuit board is configured to be mounted within a printer. Thefirst system on a chip is configured to be mounted on the first circuitboard. The wireless transceiver includes a receiver and a transmitter.The receiver is implemented in the first system on a chip. The receiveris configured to (i) wirelessly receive a first radio frequency signal,and (ii) generate a first baseband signal based on the first radiofrequency signal. The transmitter is implemented in the first system ona chip. The transmitter is configured to wirelessly transmit, based on asecond baseband signal, a second radio frequency signal. The secondsystem on a chip is separate from the first system on a chip. The secondsystem on a chip is configured to be mounted on the first circuit board.The second system on a chip includes a first processing module, aprocessor, and a second processing module. The first processing moduleis configured to (i) process the first baseband signal and the secondbaseband signal, and (ii) generate a data signal based on the firstbaseband signal. The processor is configured to generate the secondbaseband signal based on the first baseband signal. The secondprocessing module is configured to implement a printing process basedthe data signal.

In other features, a first system on a chip is provided and includes acontrol module configured to: be implemented in a printer; communicatewith a print mechanism in the printer; receive a first radio frequencysignal transmitted within the printer and from a wireless transceiver tothe first system on a chip; and transmit a second radio frequency signalfrom the first system on a chip to the wireless transceiver. The controlmodule includes a first processing module configured to: receive thefirst radio frequency signal from the wireless transceiver; generate afirst baseband signal based on the first radio frequency signal; basedon a second baseband signal, wirelessly transmit the second radiofrequency signal using the wireless transceiver; and generate a datasignal based on the first baseband signal. The control module furtherincludes a processor and a second processing module. The processor isconfigured to generate the second baseband signal based on the firstbaseband signal. The second processing module is configured to print viathe print mechanism and based on the data signal.

A system in a package is provided and includes a printed circuit board,a first system on a chip, and a second system on a chip. The printedcircuit board is configured to connect to a second circuit board mountedwithin a printer. The first system on a chip is configured to mount onthe printed circuit board. The first system on a chip includes areceiver and a transmitter. The receiver is configured to (i) receive afirst radio frequency signal from a low noise amplifier, and (ii)generate a first baseband signal based on the first radio frequencysignal. The transmitter is configured to transmit, based on a secondbaseband signal, a second radio frequency signal to a power amplifier.The receiver, the low noise amplifier, the transmitter, and the poweramplifier operate collectively as a wireless transceiver.

The second system on a chip is separate from the first system on a chip.The second system on a chip is configured to mount on the printedcircuit board and includes a baseband processing module and an imagingmodule. The baseband processing module is configured to (i) process thefirst baseband signal and the second baseband signal, and (ii) generatea data signal based on the first baseband signal. The imaging module isconfigured to process the data signal to implement physical printing.

In other features, a printer is provided and includes a wirelesstransceiver in communication with a network device. The network deviceis separate from the printer. The wireless transceiver includes a lownoise amplifier configured to receive a first radio frequency signalfrom the network device. A receiver is configured to (i) receive thefirst radio frequency signal from the low noise amplifier, and (ii)generate a first baseband signal based on the first radio frequencysignal. A transmitter is configured to generate a second radio frequencysignal based on a second baseband signal. A power amplifier isconfigured to transmit the second radio frequency signal to the networkdevice.

The printer also includes a system in a package. The system in a packageincludes a printed circuit board, a first system on a chip and a secondsystem on a chip. The first system on a chip is configured to mount onthe printed circuit board. The first system on a chip includes thereceiver and the transmitter. The second system on a chip separate fromthe first system on a chip. The second system on a chip is configured tomount on the printed circuit board. The second system on a chip includesa baseband processing module configured to (i) process the firstbaseband signal and the second baseband signal, and (ii) generate a datasignal based on the first baseband signal. The imaging module configuredto process the data signal to generate an image signal, wherein physicalprinting is performed according to the image signal. A print mechanismis configured to (i) receive the image signal, and (ii) perform thephysical printing in response to the image signal.

A method is provided and includes operating a system in a package. Themethod includes receiving, at a receiver, a first radio frequency signalfrom a low noise amplifier. A first baseband signal is generated basedon the first radio frequency signal. Based on a second baseband signal,a second radio frequency signal is transmitted from a transmitter to apower amplifier. The receiver and the transmitter are implemented in afirst system on a chip. The first system on a chip is mounted on aprinted circuit board. The printed circuit board is configured toconnect to a second circuit board mounted within a printer. Thereceiver, the low noise amplifier, the transmitter, and the poweramplifier operate collectively as a wireless transceiver.

The method further includes processing the first baseband signal and thesecond baseband signal using a baseband processing module. A data signalis generated based on the first baseband signal. The data signal isprocessed to implement physical printing using an imaging module. Thebaseband processing module and the imaging module are implemented withina second system on a chip. The second system on a chip is separate fromthe first system on a chip. The second system on a chip is mounted onthe printed circuit board.

In other features, a wireless printer system is provided and includes awireless transceiver that generates a baseband signal based on areceived radio frequency signal. A first system on a chip communicateswith the wireless transceiver. The system on a chip includes a wirelessinterface module and an imaging module. The wireless interface moduleprocesses the baseband signal to generate a print data signal via awireless interface software. The imaging module processes the print datasignal to generate a print image signal via an imaging software.

In other features, the first system on a chip includes a centralprocessing unit.

In still other features, the wireless printer system further includes asystem in a package that includes the first system on a chip. In otherfeatures, the system in a package includes memory that communicates withthe wireless interface module and the imaging module. In other features,the memory includes a second system on a chip. In other features, thesecond system on a chip includes the wireless interface software and theimaging software. In yet other features, the memory includes wirelessinterface software and imaging software.

In further features, the system in a package includes a memoryintegrated circuit that stores wireless interface software and printerimaging software and data. In other features, the system in a packageincludes at least one component of the wireless transceiver. In otherfeatures, the system in a package includes at least one component of thewireless transceiver selected from a receiver, a transmitter, a lownoise amplifier, and a power amplifier. In other features, the system ina package includes dice. In other features, the dice include atransceiver die and a memory die.

In still other features, the first system on a chip includes a networkprocessing module. In other features, the first system on a chipincludes at least one peripheral processing module. In other features,the first system on a chip includes at least one input/output (I/O)processing module.

In yet other features, a printer is provided that includes the wirelessprinter system and further includes a print mechanism that prints basedon the print image signal.

In other features, a method of operating a wireless printer system isprovided. The method includes generating a baseband signal based on areceived radio frequency signal via a wireless transceiver. The wirelesstransceiver is communicated with via a system on a chip. The basebandsignal is processed to generate a print data signal on the system on achip using a wireless interface software. The print data signal isprocessed to generate a print image signal on the system on a chip usingimaging software.

In further features, the method includes generating the print datasignal and the print image signal via a central processing unit.

In other features, the method includes communicating with the wirelesstransceiver via a system in a package that includes the system on achip. In yet other features, the method includes communicating with thewireless interface module and the imaging module via memory that isincluded in the system in a package. In other features, the methodincludes communicating with the wireless interface module and theimaging module via the wireless interface software and the imagingsoftware, which are stored in the memory.

In still other features, the method includes generating the print datasignal and the print image signal via a printer. Printing is based onthe print image signal.

In other features, a wireless printer system is provided that includeswireless transceiving means for generating a baseband signal based on areceived radio frequency signal. A first system on a chip forcommunicating with the wireless transceiving means is included. Thefirst system on a chip includes wireless interface means for processingthe baseband signal to generate a print data signal via a wirelessinterface software. The first system on a chip also includes imagingmeans for processing the print data signal to generate a print imagesignal via an imaging software.

In further features, the first system on a chip includes a centralprocessing unit.

In other features, the wireless printer system further includes a systemin a package that includes the first system on a chip.

In other features, the system in a package includes storing means forcommunicating with the wireless interface means and the imaging means.In still other features, the storing means includes a second system on achip. In other features, the second system on a chip includes thewireless interface software and the imaging software. In other features,the storing means includes wireless interface software and imagingsoftware.

In yet other features, the system in a package includes storing meansthat stores wireless interface software and printer imaging software anddata. In other features, the system in a package includes at least onecomponent of the wireless transceiving means. In other features, thesystem in a package includes at least one component of the wirelesstransceiving means selected from a receiver, a transmitter, a low noiseamplifier, and a power amplifier. In other features, the system in apackage includes dice. In other features, the dice include a transceiverdie and a memory die.

In further features, the first system on a chip includes a networkprocessing module. In other features, the first system on a chipincludes at least one peripheral processing module. In other features,the first system on a chip includes at least one input/output (I/O)processing module.

In other features, a printer is provided that includes the wirelessprinter system and further includes a print means for printing based onthe print image signal.

In still other features, the systems and methods described above areimplemented by a computer program executed by one or more processors.The computer program can reside on a computer readable medium such asbut not limited to memory, non-volatile data storage and/or othersuitable tangible storage mediums.

Further areas of applicability of the present disclosure will becomeapparent from the detailed description provided hereinafter. It shouldbe understood that the detailed description and specific examples, areintended for purposes of illustration only and are not intended to limitthe scope of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from thedetailed description and the accompanying drawings, wherein:

FIG. 1 is a functional block diagram of a wireless printer architectureaccording to the prior art;

FIG. 2 is a functional block diagram illustrating a wireless printercommunication system incorporating a wireless printer architectureaccording to the present disclosure;

FIG. 3 is functional block diagram illustrating a wireless printercommunication system incorporating a wireless printer architectureaccording to the present disclosure;

FIG. 4 is a side cross-sectional view of the wireless printerarchitecture of FIG. 3;

FIG. 5 is a flow diagram illustrating a method of forming a wirelessprinter architecture according to the present disclosure; and

FIG. 6 is a data flow diagram illustrating a method of wirelesslycommunicating with a printer according to the present disclosure.

DETAILED DESCRIPTION

The following description is merely exemplary in nature and is in no wayintended to limit the disclosure, its application, or uses. For purposesof clarity, the same reference numbers will be used in the drawings toidentify similar elements. As used herein, the term module refers to anApplication Specific Integrated Circuit (ASIC), an electronic circuit, aprocessor (shared, dedicated, or group) and memory that execute one ormore software or firmware programs, a combinational logic circuit,and/or other suitable components that provide the describedfunctionality. As used herein, the phrase at least one of A, B, and Cshould be construed to mean a logical (A or B or C), using anon-exclusive logical or. It should be understood that steps within amethod may be executed in different order without altering theprinciples of the present disclosure.

Also, in the following description the term “system on chip (SOC)”refers to an integration of multiple components on a single integratedcircuit. A SOC may contain digital, analog, mixed-signal, and radiofrequency functions on a single chip. For example a processor and amemory may be integrated by a SOC.

As well, in the following description the term “system in a package(SIP)” refers to two or more integrated circuits that are enclosed in asingle package or module. An SIP may perform all or most of thefunctions of an electronic system. An SIP may refer to a combination ofone or more wire bonded or flip chip dice with one or more passivecomponents attached to a standard formal microelectronic package. Thepackage forms a functional block or module that may be used as astandard component in board level manufacturing. The integrated circuitsor chips may be stacked vertically or placed horizontally alongside oneanother inside a package.

The use of an SIP and an SOC tends to reduce circuit boardcross-sectional area requirements, system cost and overall powerconsumption. A SIP provides a small footprint with wirebond assemblytechnology to allow for interconnects between elements and devices. Thewirebonds may be encapsulated in a chip-sized ball-grid array (BGA)package. A BGA refers to integrated circuit packages that have outputpins in the form of a solder ball matrix. The traces of a BGA aregenerally fabricated on laminated substrates (BT-based) orpolyimide-based films.

In the following description the terms “die” and “dice” refer to arectangular pattern or patterns on a wafer that contains circuitry toperform a specific function. A die is generally encapsulated to form achip, which may be placed on a module.

Referring now to FIG. 2, a functional block diagram illustrating awireless printer communication system 100 is shown. The wireless printerarchitecture 102 is shown in the form of a printer and thus may beincluded in a desktop printer, a network printer, a shared printer, etc.The system 100 includes a wireless printer architecture 102 that has acontrol module 104, a transceiver 106 and a memory 108. The controlmodule is shown in the form of an integrated circuit (IC). The controlmodule 104 includes baseband hardware 110 and imaging hardware 112. Thecontrol module 104 is in communication with the transceiver 106 via thebaseband hardware 110. The control module 104 is also in communicationwith a print mechanism 114 via the imaging hardware 112.

In use, the transceiver 106 wirelessly receives radio frequency (RF)print command signals and/or data via an antenna 116 and an antennainterface 118. The print signals may be received from various locationsdepending upon the mode of operation. For example, when operating in aninfrastructure mode the received signals may be received from the clientstation 120 or another device associated with a communication network121 via the access point/router 122. The access point/router 122 maycommunicate with the communication network 121 via a modem 123 and aservice provider. When operating in an ad hoc mode, the received signalsmay be received directly from a client station 120′. The client stations120, 120′ may have central processing units (CPUs). The client stationmay refer to any print signal transmission device or medium. The clientstations 120, 120′ and the access point/router 122 may be part of alocal area network (LAN), a virtual local area network (VLAN), awireless local area network (WLAN). The transceiver 106 converts theprint signals to a baseband format for reception by the control module104. The control module 104 controls the operation of the printmechanism 114 based on the baseband signals received. The communicationnetwork 121 may be or includes an Internet, an Intranet, or othercommercial, instructional or residential communication network. Thecommunication network 121 may, for example, include a wide area network(WAN). Also, and as an example, the stated communication with theprinter architecture 102 may be over designated or shared bandwidth. Ofcourse, the communication may include signals other than print commandsignals and may include transmission to and from the printerarchitecture 102.

The control module 104 may have a micro signal architecture (MSA) tohandle complex, real-time media data flow and control-oriented taskstypically handled by reduced instruction set computing (RISC)processors. Other types of processors may be used as well. The controlmodule 104 may have both digital signal processor (DSP) features andRISC features and support software that can execute video compression,motion compression, and entropy encoding algorithms used for losslessdata compression, such as Huffman coding algorithms. The statedalgorithms are used by video and image processing standards, such asMPEG2, MPEG4 and JPEG. The control module 104 may support applicationswith a convergence of capabilities including multi-format audio, video,voice and image processing, multi-mode baseband and packet processing,and real-time security and control processing.

The control module 104 may include various processing modules andcommunication interfaces, as shown. In one sample implementation, thecontrol module 104 includes a main microprocessor 130, which includes abaseband processing module 132, an image processing module 134, anetwork processing module 136, a peripheral processing module 138 and aninput/output (I/O) protocol processing module 140. The main processor130 may be a DSP or a microprocessor. The modules 132-140 may be in theform of software or firmware.

The baseband module 132 contains the logic and/or software for wirelesscommunication. The wireless communication may be based on IEEE standards802.11, 802.11a, 802.11b, 802.11g, 802.11h, 802.11n, 802.16, and 802.20or the like. The baseband module 132 may be part of a Bluetooth systemand have one or more protocol stacks or software subsystems that managethe flow of data according to a particular protocol, such astransmission control protocol/Internet protocol (TCP/IP). The basebandmodule 132 may support the various Bluetooth profiles, such as standardparallel port (SPP), hardcopy cable replacement profile (HCRP) andobject push profiles (OPP). The wireless communication may be directlybetween the control module 104 and an upstream device, such as theclient station 120′. The baseband module 132 manages communicationchannels and asynchronous and synchronous links. The baseband module 132also handles packets, paging and inquiries to access any inquire devicesin the area.

The image module 134 contains the logic and/or software associated withthe carrying out of various imaging and/or printing tasks. The imagemodule 134 may include programming for image printing, viewing andediting. The image module 134 may also process text and other variousprinting and imaging formats. The image module 134 may be used forstoring, managing or extracting information within a document or animage.

The network module 136, the peripheral module 138 and the I/O module 140include the logic and/or software for wired communication with I/O_(1-n)and any external peripherals and networks connected thereto or incommunication with the control module 104. The I/O_(1-n) may beconnected to a network, such as one above-stated, a universal serial bus(USB), a Firewire, an Ethernet line, a universalsynchronous/asynchronous receiver/transmitter (USART), a serialperipheral interface (SPI) or other communication interface. Theperipheral module 138 may also contain logic and/or software to handleinternal peripherals, such as counters, timers and generators. TheI/O_(1-n) may be in the form of serial ports or parallel ports. Theprocessing modules 132-140 may be separate modules, as shown, orcombined into a single module.

The interfaces include a transceiver interface 150, which is controlledby the baseband hardware 110. The interfaces also include a memoryinterface 152, I/O interfaces 154 and a print mechanism interface 156.The interfaces facilitate communication between the control module 104and the transceiver 106, the memory 108, the print mechanism 114 and theI/O_(1-n).

The transceiver 106 and the antenna 116 are used for the reception andtransmission of radio frequency (RF) signals to and from the clientstations 120′. The transceiver 106 includes a receiver 163 and atransmitter 164. During receiver operation, an input of a low noiseamplifier (LNA) 165 receives signals from the antenna 116, amplifies thesignals and outputs them to the receiver 163. During transmitteroperation, an output of the transmitter 164 is received by a poweramplifier (PA) 166, which outputs amplified signals to the antenna 116.While not shown, the transceiver 106 may also include a processor andother standard elements and components, such as a frequency synthesizer,a phase locked loop (PLL), and a voltage controlled oscillator (VCO).The transceiver 106 may have mixed signal components, analog and digitalcomponents, and may have multiple layers that are associated withvarious protocols for wireless communication. The stated layers maysupport WiFi and IEEE standards 802.11, 802.11a, 802.11b, 802.11g,802.11h, 802.11n, 802.16, and 802.20, as well as other communicationprotocols, connections and standards.

The memory 108 is used to store programming for the stated modules andcommunication protocols, as well as to perform the processing tasksassociated therewith. The memory 108 may include random access memory(RAM) 170 and read only memory (ROM) 172, as shown, as well as otherknown memory types. In one implementation, the RAM 170 is used forimaging hardware functionality and the ROM 172 is used to store basebandsoftware 174 and imaging software 176. As another example, the RAM 170may be discrete known good die (KGD) dynamic or static random accessmemory.

The baseband hardware 110 may contain logic devices and operates inconjunction with the baseband module 132. Baseband functions are sharedby the baseband hardware 110 and the baseband module 132. In general,tasks are divided up based on speed, efficiency, and capability. Forexample and in general, the baseband hardware 110 is quicker atencryption and decryption than the baseband module 132. As such, thebaseband hardware 110 performs the tasks associated with encryption anddecryption.

The imaging hardware 112 may contain logic devices and operates inconjunction with the image module 134. Image processing functions areshared by the imaging hardware 112 and the image module 134.

The print mechanism refers to and may include the mechanical andelectrical components that perform the printing function. The printmechanism may include print cartridges, rollers, toners, motors,photoreceptors, fusers, lasers, lamps, scanning units, corona wires,print heads, belts, paper feeders, etc.

Referring to FIG. 3, a functional block diagram illustrating a wirelessprinter communication system 100′ is shown. The printer system 100′ issimilar to the printer system 100. The printer system 100′ includes awireless printer architecture 102′ that has a wireless printer SIP 190,which contains a control module 104′, a receiver 163′ and a transmitter164′ of a transceiver 106′, and a memory 108′. The control module 104′,the receiver 163′ and a transmitter 164′, and the memory 108′ may have acontrol die 200, a transceiver die 202, and a memory die 204,respectively. Note that the LNA 165′ and the PA 166′, although not shownas such, may also be incorporated in the SIP 190 and the transceiver die202. The dice 200, 202, 204 are mounted on a microelectronic package, asopposed to being on a PCB or otherwise arranged. The memory 108′includes one or more RAM 170′ and one or more ROM 172′, which may be ona single chip. The printer architecture 102′ may be a stand-alonecircuit or package, as shown, or may be incorporated into or used aspart of a larger system.

Referring now also to FIG. 4, a sample side cross-sectional view of thewireless printer architecture 102′ is shown. The architecture 102′ isshown in the form of a single SIP and includes the dice 200, 202, 204,which are mounted on a printed circuit board 210. The printed circuitboard 210 has a rigid laminate 212 that is disposed between a top layer214 and a bottom layer 216. The top layer 214 is in communication withthe bottom layer 216 through the use of via 218. The top layer 214 has afirst solder mask 220 and the bottom layer 216 has a second solder mask222. The dice 200, 202, 204 are mounted on the top layer 214. The dice200, 202, 204 and any surface mounted devices of the SIP are encased ina molded compound or encasement 224. Solder balls 226 are connected tothe bottom layer 216 for connection to a circuit board (not shown).Although the architecture 102′ is shown as having a single die layer andwith multiple SICs, an architecture may be formed to include stackeddice or stacked SICs.

The architectures described above allows for efficient use ofprocessors, memories, and electrical connectors and connections. Thearchitectures minimize idle processor operation time and memory and I/Oredundancies. The architectures also allow for increased connectivityrates due to the minimization of the number of components, theelimination of communications between multiple processors and the closeproximity of the components used. The architectures also minimize PCBsurface area and system complexity.

Referring now to FIG. 5, a process flow diagram illustrating a method offorming a wireless imaging communication architecture is shown. Themethod describes the formation of a single SIP architecture.

In step 250, screen paste is applied to a printed circuit board (PCB),such as the PCB 210. The screen paste may be applied using a mesh screenstencil printing or a metal stencil printing process. In step 252,surface mount devices (SMDs) are directly mounted on the surface of thePCB. In step 254, the dice 200, 202, 204 are attached to the PCB. Thedice 200, 202, 204 may be bonded or glued onto the PCB.

In step 256, a wire bonding process is performed to allow for connectionto the dice 200, 202, 204 and other elements of the SIP. Wire may beattached using some combination of heat, pressure, and ultrasonic energyto make a weld.

Referring to FIG. 6, a data flow diagram illustrating a method ofwirelessly communicating with a printing device is shown. The method,although primarily described with respect to printing, may be easilymodified for other imaging tasks.

In step 300, a transceiver, such as one of the transceivers 106, 106′,receives an RF print command signal. The print command signal may befrom any print requesting device, such as a computer, a cell phone, apersonal data assistant (PDA), etc.

In step 302, the RF signal is amplified. In step 304, the amplified RFsignal is converted into a baseband signal. In step 306, a wirelesstransceiver interface, such as one of the transceiver interfaces 150,150′, receives the baseband signal. In step 308, a wirelesscommunication module or baseband processing module, such as the basebandmodule 132, processes the baseband signal to generate a print datasignal.

In step 310, an imaging module, such as the image module 134, processesthe print data signal to generate a print ready image signal. The imageprocessing module performs the appropriate compressing, decompressing,editing, converting, tracking, stabilizing and other image processingtasks to generate the print ready image signal.

In step 312, a print mechanism, such as the print mechanism 114, printsbased on the print ready image signal.

Those skilled in the art can now appreciate from the foregoingdescription that the broad teachings of the disclosure can beimplemented in a variety of forms. Therefore, while this disclosureincludes particular examples, the true scope of the disclosure shouldnot be so limited since other modifications will become apparent to theskilled practitioner upon a study of the drawings, the specification andthe following claims.

What is claimed is:
 1. A system comprising: a first circuit boardconfigured to be mounted within a printer; a first system on a firstchip configured to be mounted on the first circuit board; a wirelesstransceiver comprising a receiver implemented in the first system on thefirst chip, wherein the receiver is configured to (i) wirelessly receivea first radio frequency signal, and (ii) generate a first basebandsignal based on the first radio frequency signal, and a transmitterimplemented in the first system on the first chip, wherein thetransmitter is configured to wirelessly transmit, based on a secondbaseband signal, a second radio frequency signal; and a second system ona second chip separate from the first system on the first chip, whereinthe second system on the second chip is configured to be mounted on thefirst circuit board, and wherein the second system on the second chipcomprises a first processing module configured to (i) process the firstbaseband signal and the second baseband signal, and (ii) generate a datasignal based on the first baseband signal, a processor configured togenerate the second baseband signal based on the first baseband signal,and a second processing module configured to implement a printingprocess based on the data signal.
 2. The system of claim 1, wherein: thetransceiver comprises a low noise amplifier and a power amplifier; thereceiver is configured to receive the first radio frequency signal fromthe low noise amplifier; and the transmitter is configured to transmitthe second radio frequency signal to the power amplifier.
 3. The systemof claim 2, wherein: the first radio frequency signal is transmittedfrom the low noise amplifier to the system in a package; and the secondradio frequency signal is transmitted from the system in the package tothe power amplifier.
 4. The system of claim 2, wherein: the low noiseamplifier is configured to receive the first radio frequency signal, viaan antenna, from a network device, wherein the network device isseparate from the printer; and the power amplifier is configured totransmit the second radio frequency signal, via the antenna, to thenetwork device.
 5. The system of claim 4, further comprising a printmechanism, wherein: the second processing module is configured toprocess the data signal to generate an image signal recognizable to theprint mechanism, and (ii) transmit the image signal to the printmechanism within the printer; and the print mechanism is configured toprint in response to the image signal.
 6. The system of claim 1,wherein: the first radio frequency signal is transmitted to the printerfrom a network device that is separate from the printer; and the secondradio frequency signal is transmitted from the printer to the networkdevice.
 7. The system of claim 1, wherein: the first processing moduleis configured to process, using wireless interface software, each of thefirst baseband signal and the second baseband signal; and the secondmodule is configured to process the data signal using imaging software.8. The system of claim 7, further comprising a third system on a thirdchip in communication with the second system on the second chip,wherein: the third system on the third chip comprises memory; and thememory stores the wireless interface software and the imaging software.9. The system of claim 1, wherein: the second processing module isconfigured to (i) process the data signal to generate an image signalrecognizable to a print mechanism, and (ii) transmit the image signal tothe print mechanism within the printer; and the print mechanism isconfigured to print in response to the image signal.
 10. The system ofclaim 1, wherein the first circuit board is configured to connect to asecond circuit board, and wherein the first circuit board comprises: afirst layer, wherein the first system on the first chip and the secondsystem on the second chip are mounted on the first layer; a second layerconfigured to connect to the second circuit board by solder balls; alaminate layer (i) disposed between the first layer and the secondlayer, and (ii) comprising via, wherein the via are configured toelectrically connect the first layer to the second layer; and anencasement covering the first system on the first chip and the secondsystem on the second chip.
 11. The system of claim 10, wherein the firstcircuit board comprises: a first solder mask disposed between (i) thefirst system on the first chip and the second system on the second chip,and (ii) the first layer; and a second solder mask disposed between thesecond layer and the solder balls.
 12. The system of claim 10, furthercomprising a third system on a third chip, wherein: the third system onthe third chip is in communication with the second system on the secondchip; the third system on the third chip is configured to be mounted onthe first layer; the first processing module is configured to processthe first baseband signal and the second baseband signal using wirelessinterface software; the second processing module is configured toprocess the data signal using imaging software; the third system on thethird chip comprises memory; the memory stores the wireless interfacesoftware and the imaging software; and the encasement covers the thirdsystem on the third chip.
 13. A first system on a first chip comprising:a control module configured to be implemented in a printer, communicatewith a print mechanism in the printer, receive a first radio frequencysignal transmitted within the printer and from a wireless transceiver tothe first system on the first chip, and transmit a second radiofrequency signal from the first system on the first chip to the wirelesstransceiver, wherein the control module comprises a first processingmodule configured to receive the first radio frequency signal from thewireless transceiver, generate a first baseband signal based on thefirst radio frequency signal, based on a second baseband signal,wirelessly transmit the second radio frequency signal using the wirelesstransceiver, and generate a data signal based on the first basebandsignal; a processor configured to generate the second baseband signalbased on the first baseband signal; and a second processing moduleconfigured to print via the print mechanism and based on the datasignal.
 14. The first system on the first chip of claim 13, wherein thecontrol module comprises: first logic devices configured to receive thefirst radio frequency signal from the wireless transceiver, forward thefirst radio frequency signal to the first processing module, transmitthe second radio frequency signal from the first processing module tothe wireless transceiver, and encrypt or decrypt at least one of thefirst radio frequency signal and the second radio frequency signal; andsecond logic devices configured to (i) receive the data signal from thesecond processing module, (ii) generate an imaging signal based on thedata signal, and (iii) initiate printing via the print mechanism basedon the imaging signal.
 15. The first system on the first chip of claim13, wherein: the first processing module is configured to process thefirst baseband signal and the second baseband signal using wirelessinterface software; and the second processing module is configured toprocess the data signal using imaging software.
 16. A system comprising:a system in a package comprising the first system on the first chip ofclaim 13, wherein the first system on the first chip is configured togenerate an image signal based on the data signal, a second system on asecond chip, and the wireless transceiver in communication with anetwork device, wherein the network device is separate from printer, andwherein the wireless transceiver comprises a low noise amplifierconfigured to receive the first radio frequency signal from the networkdevice, a receiver implemented in the second system on the second chip,wherein the receiver is configured to (i) receive the first radiofrequency signal from the low noise amplifier, and (ii) generate thefirst baseband signal based on the first radio frequency signal, atransmitter implemented in the second system on the second chip, whereinthe transmitter is configured to generate the second radio frequencysignal based on the second baseband signal, and a power amplifierconfigured to transmit the second radio frequency signal to the networkdevice; and the print mechanism configured to (i) receive the imagesignal, and (ii) print in response to the image signal.
 17. The systemof claim 16, wherein: the system in the package comprises a third systemon a third chip, wherein the third system on the third chip is incommunication with the second system on the second chip; the firstprocessing module is configured to process the first baseband signal andthe second baseband signal using wireless interface software; the secondprocessing module is configured to process the data signal using imagingsoftware; the third system on the third chip comprises memory; and thememory stores the wireless interface software and the imaging software.18. The system of claim 16, wherein: the first radio frequency signal istransmitted from the low noise amplifier to the system in the package;and the second radio frequency signal is transmitted from the system inthe package to the power amplifier.
 19. The system of claim 16, whereinthe system in the package comprises: a first layer, wherein the firstsystem on the first chip and the second system on the second chip aremounted on the first layer; a second layer configured to connect to acircuit board by solder balls; a laminate layer disposed between thefirst layer and the second layer, wherein the laminate layer comprisesvia, and wherein the via are configured to electrically connect thefirst layer to the second layer; and an encasement covering the firstsystem on the first chip and the second system on the second chip. 20.The system of claim 19, wherein: the system in the package comprises athird system on a third chip; the third system on the third chip is incommunication with the second system on the second chip; the thirdsystem on the third chip is configured to be mounted on the first layer;the first processing module is configured to process the first basebandsignal and the second baseband signal using wireless interface software;the second processing module is configured to process the data signalusing imaging software; the third system on a chip comprises memory; thememory stores the wireless interface software and the imaging software;and the encasement covers the third system on a chip.